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 Solder BumpSolder bump technology is used in workstation CPUs, data communication equipment, and automotive applications. It is also widely used in hard disk preamplifiers, large-capacity chips, and other applications.
Though the solder bump market was comparatively smaller than the gold bump market in the past, it has started to attract more attention because it is the bonding method for the increasingly popular flip-chip mounting, which bonds to a substrate without wire bonding.
For solder bump technology to be able to support various types of semiconductors, it must support the same fine electrode pitch as gold bump technology. It also must meet the needs of a wide range of bump structures, from round configurations to high-back configurations grown on posts.
Our long years of experience provide CASIO MICRONICS with unique semiconductor processing know-how, which allows us to develop new solder bump structures and to support environment-friendly lead-free processes.
Bump Processing (Resist Coating Process)
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