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> > Gold Bump
 Gold BumpImprovements in liquid crystal panel definition have been accompanied by demands for finer processing of the "bump" electrodes that form the terminals of liquid crystal driver chips. More specifically, these demands include prevention of shorts between terminals as terminal pitch becomes smaller and smaller, and uniform electrode height to facilitate mounting on LCD glass and other surfaces.
CASIO MICRONICS offers a logical answer to these and other needs with advanced gold bump technology. CASIO MICRONICS is the first company in its field to successfully develop a patented straight bump configuration, which enables fine-pitch bonding, and to meet of customer needs.
Semiconductor Wafer
Wafer Testing
The demands being placed on semiconductor wafer testing continue to intensify as electrode pitch becomes finer and the number of electrodes increases. CASIO MICRONICS maintains extensive multi-pin chip testing facilities that allow high-speed testing to meet the needs of our customers in the minimum time possible. |
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