| Jul |
1987 |
Establishment of company (Ome City, Tokyo) |
Apr |
1988 |
Start of TCP (Tape Carrier Package) sales for CASIO COMPUTER CO., LTD. calculators |
Apr |
1992 |
Start of gold BUMP consignment processing |
Jul |
1997 |
Start of solder BUMP consignment processing |
Jul |
1998 |
Support for 8-inch wafers for gold BUMP consignment processing |
Jun |
1999 |
BUMP Business Division ISO9002 certification |
Mar |
2000 |
Headquarters/Ome Factory ISO14001 certification |
May |
2001 |
Start of wafer-level chip size packages (W-CSP) mass production at Ome Factory |
Aug |
2001 |
Listed on the JASDAQ market (Code Number 6760) |
Mar |
2003 |
Achievement of zero emissions (waste landfill percentage of less than 1%) in the whole company |
Jan |
2005 |
Establishment of Ome Factory No.2 as 12-inch wafer processing for W-CSP and solder BUMP |
Mar |
2006 |
Start of solder BUMP consignment processing at Ome Factory No.2 |
Aug |
2006 |
Start of wafer-level chip size packages (W-CSP) mass production at Ome Factory No.2 |
Jun |
2008 |
Transfer of Film Device Business to Hitachi Cable Co., Ltd. |
Jul |
2008 |
Delisted from JASDAQ market. |
Aug |
2008 |
Full Subsidiary of CASIO COMPUTER Co., Ltd. |
