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> > About CASIO MICRONICS
CASIO MICRONICS is a company that makes it possible to fit digital devices (cell phone, LCD monitors, etc.) with large-scale integrated circuits. Our business is centered on production of chip packages for power supply IC, sound source LSI, and other types of chips, in addition to the electrode processing for liquid crystal drivers (chips that sends image to liquid crystal displays).
The core technologies of CASIO MICRONICS include sputtering, photolithography, etching, plating, and other chip production technology. These technologies are applied to produce a wide range of high density embedding devices such as
wafer-level chip size packages (W-CSP), solder bump, and
gold bump, all of which have play vital role at back-end process in semiconductor industry.
CASIO MICRONICS technology is helping to bring the convenience of cell phones and flat panel displays to people around the globe.
Under the slogan "Smart & Fine Technologies," we remain committed to unrelenting innovation and development of new products and processes, including original fine processing techniques that work at thicknesses finer than a strand of hair. Everything we do at CASIO MICRONICS is undertaken with a goal of improving our products and services.
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